AP NEWS

Global Semiconductor Wafer Inspection Equipment Market 2019-2023 - ResearchAndMarkets.com

January 4, 2019

DUBLIN--(BUSINESS WIRE)--Jan 4, 2019--The “Global Semiconductor Wafer Inspection Equipment Market 2019-2023” report has been added to ResearchAndMarkets.com’s offering.

The semiconductor wafer inspection equipment market will register a CAGR of more than 6% by 2023.

The growing investments in lower technology node to drive growth in the market

Semiconductor industries and IDMs are investing heavily on R&D to identify new technologies that can support the production of smaller process nodes.

Increasing number of data centers

With an increasing number of data centers, there has been a rising demand for semiconductor components. Semiconductors are an integral part of data centers, which have thousands of servers and each server runs with the help of semiconductor ICs.

Complexity of technological transitions

A major challenge hindering growth of the global semiconductor wafer inspection equipment market is the complexity of technological transitions that are occurring across the semiconductor industry.

Key Players

Applied Materials ASML Hitachi High-Technologies KLA-Tencor Rudolph Technologies

Topics Covered

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: MARKET LANDSCAPE

Market ecosystem Market segmentation analysis Market characteristics

PART 04: MARKET SIZING

Market definition Market sizing 2018 Market size and forecast 2018-2023

PART 05: FIVE FORCES ANALYSIS

PART 06: MARKET SEGMENTATION BY TECHNOLOGY

Market segmentation by technology Comparison by technology Optical wafer inspection - Market size and forecast 2018-2023 E-beam wafer inspection - Market size and forecast 2018-2023 Market opportunity by technology

PART 07: CUSTOMER LANDSCAPE

PART 08: MARKET SEGMENTATION BY END-USER

Market segmentation by end-user Comparison by end-user Foundries - Market size and forecast 2018-2023 IDMs - Market size and forecast 2018-2023 Market opportunity by end-user

PART 09: GEOGRAPHIC LANDSCAPE

Geographic segmentation Geographic comparison APAC - Market size and forecast 2018-2023 Americas - Market size and forecast 2018-2023 EMEA - Market size and forecast 2018-2023 Key leading countries Market opportunity

PART 10: DRIVERS AND CHALLENGES

Increasing focus on large diameter wafer size Growing investments in lower technology node Growing investment in 3D NAND and FinFET technologies

PART 11: VENDOR LANDSCAPE

Overview Landscape disruption Competitive scenario

PART 12: VENDOR ANALYSIS

Vendors covered Vendor classification Market positioning of vendors Applied Materials ASML Hitachi High-Technologies KLA-Tencor Rudolph Technologies

For more information about this report visit https://www.researchandmarkets.com/research/ctxwhq/global?w=4

View source version on businesswire.com:https://www.businesswire.com/news/home/20190104005398/en/

CONTACT: ResearchAndMarkets.com

Laura Wood, Senior Press Manager

press@researchandmarkets.com

For E.S.T Office Hours Call 1-917-300-0470

For U.S./CAN Toll Free Call 1-800-526-8630

For GMT Office Hours Call +353-1-416-8900

Related Topics:Semiconductor

KEYWORD:

INDUSTRY KEYWORD: TECHNOLOGY SEMICONDUCTOR

SOURCE: Research and Markets

Copyright Business Wire 2019.

PUB: 01/04/2019 11:34 AM/DISC: 01/04/2019 11:33 AM

http://www.businesswire.com/news/home/20190104005398/en

AP RADIO
Update hourly