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Global Electronics and Electrical Ceramics Market 2018-2022 - Emergence of 3D Chip Packaging Technology Gaining Momentum - ResearchAndMarkets.com

September 21, 2018

DUBLIN--(BUSINESS WIRE)--Sep 21, 2018--The “Global Electronics and Electrical Ceramics Market 2018-2022” report has been added to ResearchAndMarkets.com’s offering.

The global electronics and electrical ceramics market to register a revenue of close to USD 13 billion by 2022.

Global Electronics and Electrical Ceramics Market 2018-2022 has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

One trend in the market is emergence of 3D chip packaging technology. The 3D packaging technology has revolutionized chip packaging. It enables chip manufacturers to create 3D ICs, and it also helps in the manufacturing process of miniaturized electronic products.

According to the report, one driver in the market is increasing use of ceramics for energy storage. Every device runs on a battery, and there is an increasing demand for portable devices worldwide. The escalating use of smartphones, smart gadgets, and portable devices require efficient power storage systems.

Further, the report states that one challenge in the market is high production cost. Fluctuations in the cost of raw materials are affecting the supply of electronics and electrical ceramics products in the market, thereby posing a challenge to the market in focus.

Key vendors

3M CeramTec CoorsTek KYOCERA Morgan Advanced Materials

Key Topics Covered:

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

Market ecosystem Market characteristics Market segmentation analysis

PART 05: MARKET SIZING

Market definition Market sizing 2017 Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

Bargaining power of buyers Bargaining power of suppliers Threat of new entrants Threat of substitutes Threat of rivalry Market condition

PART 07: MARKET SEGMENTATION BY APPLICATION

Segmentation by application Comparison by application Home appliances Consumer electronics Power grids and energy Medical devices Others Market opportunity by application

PART 08: MARKET SEGMENTATION BY PRODUCT

PART 09: CUSTOMER LANDSCAPE

PART 10: REGIONAL LANDSCAPE

Geographical segmentation Regional comparison Market opportunity

PART 11: DECISION FRAMEWORK

PART 12: DRIVERS AND CHALLENGES

PART 13: MARKET TRENDS

Emergence of 3D chip packaging technology Green electronics New technology development

PART 14: VENDOR LANDSCAPE

Overview Landscape disruption Competitive scenario

PART 15: VENDOR ANALYSIS

Vendors covered Vendor classification Market positioning of vendors

For more information about this report visit https://www.researchandmarkets.com/research/np58jm/global?w=4

View source version on businesswire.com:https://www.businesswire.com/news/home/20180921005473/en/

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Related Topics:Ceramics

KEYWORD:

INDUSTRY KEYWORD: TECHNOLOGY SEMICONDUCTOR

SOURCE: Research and Markets

Copyright Business Wire 2018.

PUB: 09/21/2018 01:08 PM/DISC: 09/21/2018 01:08 PM

http://www.businesswire.com/news/home/20180921005473/en

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