DUBLIN--(BUSINESS WIRE)--Sep 12, 2018--The "Global Flip Chip Packages Market 2018-2022" report has been added to ResearchAndMarkets.com's offering.

The global flip chip packages market to grow at a CAGR of 6.35% during the period 2018-2022.

Global Flip Chip Packages Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report also includes a discussion of the Key vendors operating in this market. To calculate the market size, the report considers the sales of semiconductor devices based on flip chip packaging technology to end-user sectors including communication, computing and networking, industrial, and automotive.Flip chip is a packaging technology that interconnects chips and package carriers or substrates with conductive bumps. The use of the technology in semiconductor chip packaging ensures a direct electrical connection of face-down electronic dies with organic or ceramic circuit boards using conductive bumps on the chip bond pads.According to the report, one of the major drivers for this market is the increasing number of fabs. The growing application of semiconductor components in various emerging technologies such as IoT and AI has increased the need for silicon wafers, in turn, increasing the need for more fabs, thus, driving the market's growth during the predicted period.The latest trend gaining momentum in the market is the rising integration of semiconductor components in automobiles. Semiconductor ICs are being used for several purposes in automobiles such as airbag control systems, GPS, ABS, displays, infotainment systems, power doors and windows, automated driving, and collision detection technology. Further, the report states that one of the major factors hindering the growth of this market is the rapid technological changes in the semiconductor industry. Rapid technological advances in wafer processing is a key challenge for the vendors in the global semiconductor packaging market.

Key vendors

Advanced Semiconductor EngineeringChipbond TechnologyIntelSiliconware Precision IndustriesTaiwan Semiconductor Manufacturing Company

Key Topics Covered:

Part 01: Executive Summary

Part 02: Scope Of The Report

Part 03: Research Methodology

Part 04: Market Landscape

Part 05: Market Sizing

Part 06: Five Forces Analysis

Part 07: Market Segmentation By Bumping Technology

Part 08: Customer Landscape

Part 09: Market Segmentation By End-User

Part 10: Regional Landscape

Part 11: Decision Framework

Part 12: Drivers And Challenges

Part 13: Market Trends

Part 14: Vendor Landscape

Part 15: Vendor Analysis

Part 16: Appendix

For more information about this report visit https://www.researchandmarkets.com/research/mfv5pm/global_flip_chip?w=4

View source version on businesswire.com:https://www.businesswire.com/news/home/20180912005437/en/

CONTACT: ResearchAndMarkets.com

Laura Wood, Senior Manager


For E.S.T Office Hours Call 1-917-300-0470

For U.S./CAN Toll Free Call 1-800-526-8630

For GMT Office Hours Call +353-1-416-8900

Related Topics:Semiconductor



SOURCE: Research and Markets

Copyright Business Wire 2018.

PUB: 09/12/2018 04:36 AM/DISC: 09/12/2018 04:36 AM