Global Atomic Layer Deposition Market 2018-2022 - High Demand for NAND Storage / High Cost of ALD Systems / Competitive Landscape - ResearchAndMarkets.com
DUBLIN--(BUSINESS WIRE)--Jan 2, 2019--The “Global Atomic Layer Deposition Market 2018-2022” report has been added to ResearchAndMarkets.com’s offering.
The market research analysts have predicted that the atomic layer deposition market will register a CAGR of almost 13% by 2022.
The new technologies such as 3D NAND storage are being developed with the growing demand for NAND storage. 3D NAND storage provides higher storage capacity due to multi-storeyed stacking of layers of memory structures. Therefore, atomic layer deposition (ALD) systems helps in manufacturing 3D NAND as it allows the deposition of several controlled and precise layers on the substrate which gives it a stacked structure and thereby increases its storage capacity. Hence, ALD is used to create di-electric films for 3D NAND systems, the increasing demand for NAND storage will drive the atomic layer deposition market growth.
High demand for NAND storage
The high degree of process control required in developing 3D NAND memory systems, ALD is extensively employed to create di- electric films the 3D NAND systems. Therefore, the increasing demand of 3D NAND memory systems, the market will grow during the forecast period.
High cost of ALD systems
Due to high cost of ALD, the vendors in the market providing ALD systems have also reduced their investments in ALD technology. This had led the semiconductor manufacturers can use substitutes like CVD systems with lower costs compared with ALD systems.
The global atomic layer deposition market is highly concentrated with the presence of few established companies competing for the market share. This market research report will help clients identify new growth opportunities and design unique growth strategies by providing a comprehensive analysis of the markets competitive landscape and offering information on the products offered by companies.
Key Topics Covered:
PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: RESEARCH METHODOLOGY
PART 04: MARKET LANDSCAPEMarket ecosystem Market characteristics Market segmentation analysis
PART 05: MARKET SIZINGMarket definition Market sizing 2017 Market size and forecast 2017-2022
PART 06: FIVE FORCES ANALYSISBargaining power of buyers Bargaining power of suppliers Threat of new entrants Threat of substitutes Threat of rivalry Market condition
PART 07: CUSTOMER LANDSCAPE
PART 08: SEGMENTATION BY APPLICATIONSegmentation by application Comparison by Application Memory Logic devices MEMS and other semiconductors Market opportunity by Application
PART 09: REGIONAL LANDSCAPEGeographical segmentation Regional comparison Key leading countries Market opportunity
PART 10: DECISION FRAMEWORK
PART 11: DRIVERS AND CHALLENGES
PART 12: MARKET TRENDSFocus on increasing wafer sizes Development of area selected ALD Increasing use of ALD in electric vehicles
PART 13: VENDOR LANDSCAPELandscape disruption Competitive scenario
PART 14: VENDOR ANALYSISVendors covered Vendor classification Market positioning of vendors Applied Materials ASM International Beneq Lam Research Tokyo Electron
For more information about this report visit https://www.researchandmarkets.com/research/dl9mlj/global_atomic?w=4
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Related Topics:Chemical Engineering
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SOURCE: Research and Markets
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PUB: 01/02/2019 04:57 AM/DISC: 01/02/2019 04:56 AM