Complete Teardown Report of Hamamatsu’s C12880MA Micro-Spectrometer - ResearchAndMarkets.com

August 29, 2018

DUBLIN--(BUSINESS WIRE)--Aug 29, 2018--The “Hamamatsu C12880MA Micro-Spectrometer Complete Teardown Report” report has been added to ResearchAndMarkets.com’s offering.

This report contains a detailed physical analysis with process description and manufacturing cost analysis. It also includes a full comparison with the NanoLambda NSP32 and Consumer Physics SCiO spectrometers.

For a long time, spectral analysis of materials has been reserved for academic research laboratories. The arrival of new small and cheap sensors allows their integration into new products and industrial environments to increase the quality of production and product control.

The spectrum data measured by the Hamamatsu C12880MA micro-spectrometer is compatible with the spectrum data measured by conventional optical spectrum analyzers, which facilitates the use of this device without needing to create a database.

The C12880MA is a 2.5cm3 spectrometer head that could be integrated into a wide range of measurement and quality control equipment. Working with wavelengths between UV and near IR, 340-850nm, the micro-spectrometer can be used for food inspection, biometry, water quality, light testing and light level measurements.

The CMOS linear image sensor provides spectral resolution of 15nm. Moreover, the hermetic package allows its use in moist atmosphere. The small package integrates the light sensor and diffractive elements, here a reflective grating and slit.

Key Topics Covered:

1. Overview/Introduction

Executive Summary Reverse Costing Methodology

2. Company Profile

Hamamatsu Photonics C12880MA Characteristics

3. Physical Analysis

Summary of the Physical Analysis Package Package views and dimensionsPackage opening and cross-section Reflective Grating DimensionsCross-section Die Details view, dimensions and markingsColor sensorsActive area deprocessing, die processDie cross-section: metal layers, active areaSlit cross-sectionProcess characteristics Comparison Between C12880MA and NanoLambda NSP32 and Consumer Physics SCIO Molecular sensor

4. Sensor Manufacturing Process

Overview IC Front-End Process Image Sensor Process Flow Reflective Grating Process Flow Packaging Process Flow

5. Cost Analysis

Summary of the Cost Analysis Image Sensor IC wafer front-end costSensor layers wafer front-end costSensor layers front-end cost per process stepBack-end 0: probe test and dicing wafer and die cost Reflective Grating Cost Component Back-end: packaging costBack-end: final test costComponent cost

6. Selling Price

For more information about this report visit https://www.researchandmarkets.com/research/vl764b/complete_teardown?w=4

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SOURCE: Research and Markets

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PUB: 08/29/2018 05:18 AM/DISC: 08/29/2018 05:18 AM


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