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Global Printed Circuit Boards Technologies and Markets, 2023 - Influence of Internet of Things (IoT), Automotive and Manufacturing Sectors - ResearchAndMarkets.com

October 3, 2018

DUBLIN--(BUSINESS WIRE)--Oct 3, 2018--The “Printed Circuit Boards: Technologies and Global Markets” report has been added to ResearchAndMarkets.com’s offering.

The market scope is defined through consideration of various end-user applications, including mobile phones and tablets, networking devices, instrumentation and scientific research, healthcare, defense, surveillance and aviation, energy, consumer electronics, computing and storage, industrial, automotive and transportation, and retail. Market estimates are classified on the basis of PCB types and geographic regions. Various types of PCBs covered in this report are one-to two-layer rigid, multilayer rigid, microvia or high-density interconnects (HDI), flex, and rigid flex.

The Report Includes:

113 tables An overview of the global market for Printed Circuit Board (PCB) Analyses of global market trends, with data from 2017, estimates for 2018 and projections of CAGRs through 2023 Definition, types and characteristics of PCB adoption in end applications Discussion of the influence of internet of things (IoT), automotive and manufacturing sectors to the growth of PCB industry Company profiles of major players in the market, including Nippon Mektron, Zhen Ding Technology Holding Limited, TTM Technologies, Young Poong Electronics Co., Ltd., Unimicron Technology Corp., and Samsung Electro-Mechanics

Key Topics Covered:

Chapter 1 Introduction

Chapter 2 Summary And Highlights

Chapter 3 Market Overview

Chapter 4 Market Breakdown By Type

Chapter 5 Market Breakdown By End-User Application

Chapter 6 Market Breakdown By Region

Chapter 7 Competitive Landscape

Chapter 8 Company Profiles

Advanced Circuits AGY At&S CMK Corp. Compeq Dynamic Electronics Co., Ltd. Everett Charles Technologies (Xcerra Corp.) I3 Electronics, Inc. Meiko Electronics Co., Ltd. NAN YA PCB Corp. Nippon Mektron, Ltd. Samsung Electro-Mechanics Sanmina Corp. Shengyi Technology Co., Ltd. Shinko Electric Industries Co., Ltd. Sumitomo Electric Industries Ltd. Tripod TTM Technologies Unimicron Technology Corp. Young Poong Electronics Co., Ltd Zhen Ding Technology Holding Ltd.

For more information about this report visit https://www.researchandmarkets.com/research/c7hs46/global_printed?w=4

View source version on businesswire.com:https://www.businesswire.com/news/home/20181003005655/en/

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Related Topics:Printed Electronics

KEYWORD:

INDUSTRY KEYWORD: TECHNOLOGY HARDWARE SEMICONDUCTOR

SOURCE: Research and Markets

Copyright Business Wire 2018.

PUB: 10/03/2018 11:45 AM/DISC: 10/03/2018 11:45 AM

http://www.businesswire.com/news/home/20181003005655/en

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