Global LED Encapsulation Market 2018-2023: Projected to Register a CAGR of +13.52% - ResearchAndMarkets.com

September 27, 2018

DUBLIN--(BUSINESS WIRE)--Sep 27, 2018--The “Global LED Encapsulation Market - Segmented by Encapsulant Type, End-user Industries (Consumer Electronics, Automotive, and Commercial Lighting), and Region - Growth, Trends, and Forecast (2018-2023)” report has been added to ResearchAndMarkets.com’s offering.

The LED encapsulation market is expected to register a CAGR of over 13.52% during the forecast period 2018-2023.

The LED encapsulation market is expected to expand with the increase in LED applications across many sectors. The growth of the LED encapsulation market is dependent on the technological advancement of the LED packaging market.

Medium-power & high-power LEDs generate more heat compared to the low-power LEDs used in the consumer electronics. This can be addressed by opting for encapsulant during the LED packaging. Therefore, due to the increasing demand for medium-power and high-power LEDs, the LED Encapsulation market is expected to expand during the forecast period.

The need for a longer life of the LEDs across applications, especially in the automotive sector (automobile forward lighting), provides scope for the encapsulant material manufacturers. The positive prospect of the automotive sector, during the forecast period, therefore, supports the growth of the LED encapsulation market.

With respect to TV display application, the industry is moving from the usage of LED to OLED (Organic Light-emitting diode), which is the latest innovation and is expected to penetrate more into the market. This trend might hinder the volume growth of the LED packaging market and, thus, the encapsulation market.

Key Highlights

Silicone Encapsulant Estimated To Have the Highest Market Share Asia-Pacific is Expected to Have Highest Share in LED Encapsulation Market

Major Developments in the Market

In response to the increased production of leading-edge semiconductor packages in the region, Panasonic announced the launch of the mass production of molded underfill semiconductor encapsulation materials in Shanghai, China. Through this expansion, the company will be able to provide faster and more efficient service for semiconductor packaging customers in China, where the majority of the smartphones are being manufactured.

Companies Profiled

Dow Corning Corporation Nusil H.B. Fuller Company Shin-Etsu Chemical Co. Ltd. Henkel AG & Co. KGaA Hitachi Chemical Co. Ltd. Panasonic Corporation Epic Resins Intertronics Cree Inc. Osram Licht AG NationStar Optoelectronics Co. Ltd. Hangzhou Silan Microelectronics Co. Ltd.

Topics Covered

1. Introduction

2. Research Methodology

3. Executive Summary

4. Market Insights

5. Market Dynamics

6. LED Encapsulation Market Segmentation

7. LED Encapsulation Market Companies

8. LED Encapsulation Market Investment Analysis

9. Future of the LED Encapsulation Market

For more information about this report visit https://www.researchandmarkets.com/research/kwh27v/global_led?w=4

View source version on businesswire.com:https://www.businesswire.com/news/home/20180927005499/en/

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Related Topics:Electronic Chemicals,LED (Light Emitting Diodes)



SOURCE: Research and Markets

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PUB: 09/27/2018 08:58 AM/DISC: 09/27/2018 08:58 AM


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