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SFP-DD MSA Releases High-Speed, High-Density Interface Specification v2.0

September 17, 2018

ROME--(BUSINESS WIRE)--Sep 17, 2018--The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group announces the release of the v2.0 specification for the SFP-DD pluggable interface.

Dedicated to fostering the development of next-generation SFP form factors used in DAC and AOC cabling, and optical transceivers, the MSA consortium released the initial SFP-DD specification version 1.0 in September 2017 and earlier this year released version 1.1.

The newly updated specification version 2.0 reflects enhancements to the mechanicals, extended modules and enhanced polarizing key of the high-speed, high-density SFP-DD electrical interface, targeting support of up to 3.5 W optical modules in an enterprise environment.

The SFP-DD form factor addresses the technical challenges of achieving a double-density interface and ensuring mechanical interoperability for module components produced by different manufacturers. The innovative electrical interface is designed to support two lanes that operate up to 25 Gbps NRZ or 56 Gbps PAM4 per lane modulation — providing aggregate bandwidth of 50 Gbps NRZ or 112 Gbps PAM4 with excellent signal integrity.

’’Through strategic collaborations we work to increase speed, density and scalability in next-generation servers,” said Scott Sommers, Chair of the SFP-DD MSA. “We effectively enhance the roadmap in network applications to meet the challenging demands data centers and enterprise networking platforms are up against.”

It is anticipated that many MSA members will be demonstrating SFP-DD at the upcoming European Conference on Optical Communication, Sept 23 rd -27 th in Rome, Italy.

SFP-DD MSA founding members include Alibaba, Broadcom, Cisco, Dell EMC, Finisar, Hewlett Packard Enterprise, Huawei, Intel, Juniper Networks, Lumentum, Mellanox Technologies, Molex, and TE Connectivity. Contributing members are Accelink, Amphenol, AOI, Foxconn Interconnect Technology, Fourte, Genesis, Hisense, Infinera, Innolight, Maxim, Multilane, Nokia, Oclaro, Senko, Source Photonics, US Conec, and ZTE. To download the updated SFP-DD specification v2.0 and drawings or to explore opportunities for becoming a contributing member, please visit the MSA website www.sfp-dd.com.

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We are disclosing forward-looking information so that investors, potential investors, and other owners can better understand the mentioned Companies’ future prospects and make informed investment decisions. The information in this press release contains “forward-looking statements” within the meaning of the Private Securities Litigation Reform Act of 1995. These statements can be identified by the fact that they do not relate strictly to historical or current facts. Any forward-looking statement made by the Companies speak only as of the date on which it is made. The Companies are under no obligation to, and expressly disclaim any obligation to, update or alter their forward-looking statements, whether as a result of new information, subsequent events or otherwise.

View source version on businesswire.com:https://www.businesswire.com/news/home/20180916005029/en/

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KEYWORD: EUROPE ITALY

INDUSTRY KEYWORD: TECHNOLOGY ELECTRONIC DESIGN AUTOMATION HARDWARE NETWORKS SEMICONDUCTOR

SOURCE: SFP-DD MSA

Copyright Business Wire 2018.

PUB: 09/17/2018 02:07 AM/DISC: 09/17/2018 02:07 AM

http://www.businesswire.com/news/home/20180916005029/en

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