DUBLIN--(BUSINESS WIRE)--May 14, 2018--The "Global 3D TSV and 2.5D Market - Segmented by Technology (DDR2, DDR3, and DDR4), Application (Mobile Devices, Computing Devices, and Networking Devices), and Geography - Growth, Trends, and Forecast (2018 - 2023)" report has been added to ResearchAndMarkets.com's offering.

The global 3D TSV and 2.5D market is expected to project a growth rate of 35.2% during the forecast period 2018-2023. Shipments of smartphones is expected to reach 2 billion units by 2020, majorly due to the availability of low-cost smartphones in developing nations, such as China and India.

Key Developments in the Market

March 2017 - Advanced Semiconductor Engineering, Inc., and Cadence Design Systems, Inc., announced they have collaborated to release a System-in-Package (SiP) EDA solution, that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages.

Market Dynamics

Drivers

Expanding Market for Smartphones, Tablets, and Gaming Devices Rising Trend of Miniaturization of Electronics Devices

Restraints

High Unit Cost of 3D IC and 2.5D IC Packages

Companies Mentioned

Taiwan Semiconductor Manufacturing Company Limited Samsung Electronics Co. Ltd Toshiba Corp. Pure Storage Inc. Advanced Semiconductor Engineering Inc. Amkor Technology United Microelectronics Corp. STMicroelectronics NV Broadcom Ltd Intel Corporation Jiangsu Changing Electronics Technology Co. Ltd

Key Topics Covered

1. Introduction

2. Research Approach and Methodology

3. Executive Summary

4. Market Dynamics

5. Global 3D TSV and 2.5D IC Market - Segmentation

6. Competitive Intelligence - Company Profiles

7. Investment Analysis

8. Outlook of 3D TSV and 2.5D IC Market

For more information about this report visit https://www.researchandmarkets.com/research/f8nwgs/global_3d_tsv_and?w=4

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Related Topics:Semiconductor,Consumer Electronics,Mobile Content,Tablets and E-Readers

KEYWORD:

INDUSTRY KEYWORD: TECHNOLOGY SEMICONDUCTOR

SOURCE: Research and Markets

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PUB: 05/14/2018 11:18 AM/DISC: 05/14/2018 11:18 AM

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