DUBLIN--(BUSINESS WIRE)--Aug 17, 2018--The "Wafer-level Packaging - Global Market Outlook (2017-2026)" report has been added to ResearchAndMarkets.com's offering.

According to the report, the global Wafer-level Packaging Equipment market was estimated at $3.12 billion in 2017 and is projected to reach $15.21 billion by 2026, at a CAGR of 19.2%.

The increasing demand for high-speed and compact size of electronic products has expanded the need for wafer-level packaging market. In addition, Internet of Things (IoT) has been gaining popularity and is considered as the third wave of technology. The rising popularity of IoT and portable electronics market is expected to foster the high growth of the wafer-level packaging industry.

Moreover, WLP's technological superiority over traditional packaging techniques and the impending need of circuit miniaturization in microelectronic devices acts as drivers of the market growth. However, encapsulation being a challenge for fan-out wafer-level packaging and high initial investment functions is key constraints to the market.

Based on End-User, the electronics segment held steady growth during the forecast period. Imminent need of size reduction in electronics devices, requirement of higher data transmission speed, and improvement in efficiency collectively fuel the replacement of conventional packaging with WLP in electronics industry.

By geography, Asia Pacific held the largest market and will continue to show due to the rising disposable incomes in the market. This is accredited to the presence of various manufacturing facilities, high consumption, and production of electronic products where WLP is steadily replacing wire bond and ongoing R&D. The growing adoption of smartphones in India will permit the market to experience a tumultuous rise in demand. The production of wafer-level packaging will be focused more in the APAC region.

Key Topics Covered

1 Executive Summary

2 Preface

3 Market Trend Analysis

4 Porters Five Force Analysis

5 Global Wafer-level Packaging Equipment Market, By Integration Type

6 Global Wafer-level Packaging Equipment Market, By Packaging Technology

7 Global Wafer-level Packaging Equipment Market, By Bumping Technology

8 Global Wafer-level Packaging Equipment Market, By End-User

9 Global Wafer-level Packaging Equipment Market, By Geography

10 Key Developments

11 Company Profiling

Jiangsu Changjiang Electronics Technology Co. Ltd. Siliconware Precision Industries Infineon Technologies AG Deca Technologies KLA-Tencor Corporation Nanium SA China Wafer Level CSP Co. Ltd. STATS ChipPAC Ltd. Marvell Technology Group Ltd. Amkor Technology Inc. Qualcomm Inc. Fujitsu Ltd. Toshiba Corp. Tokyo Electron Ltd. Applied Materials Inc.

For more information about this report visit https://www.researchandmarkets.com/research/dvh5b9/global?w=4

View source version on businesswire.com:https://www.businesswire.com/news/home/20180817005223/en/

CONTACT: ResearchAndMarkets.com

Laura Wood, Senior Manager


For E.S.T Office Hours Call 1-917-300-0470

For U.S./CAN Toll Free Call 1-800-526-8630

For GMT Office Hours Call +353-1-416-8900

Related Topics:Semiconductor



SOURCE: Research and Markets

Copyright Business Wire 2018.

PUB: 08/17/2018 09:44 AM/DISC: 08/17/2018 09:44 AM