Himax Technologies Rebukes Motley Fool Article
TAINAN, Taiwan, Sept. 10, 2018 (GLOBE NEWSWIRE) -- Himax Technologies, Inc. (Nasdaq: HIMX) (“Himax” or “Company”), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today responded to a false and misleading article, Why Himax Technologies Is Struggling, published by Motley Fool, an online stock commentary blog, dated September 6, 2018. The article has subsequently been picked up by major public portals such as Nasdaq, Yahoo Finance, etc, and spread out in the investor community. The Company cautions investors that the Motley Fool article contains false and misleading information.
The Company expects TDDI will contribute substantial year-over-year growth for 2018 and 2019. Furthermore, Himax expects its WLO shipment to its anchor customer will increase substantially throughout the second half of this year and represent significant growth versus 2H17 and sequentially, versus the first half of 2018. Contributing to its growth expectations, Himax citied its strong pipeline of new WLO R&D projects with the anchor customer and other tier-1 customers.
For Android smartphones, Himax also believes its recently announced Active Stereo Camera (ASC) 3D sensing solution, jointly developed with MediaTek and Megvii for mass market models, and the Qualcomm/Himax jointly developed structured light 3D sensing solution for high end smartphone models will facilitate a broader adoption of 3D sensing on Android smartphones during 2019. The Company targets to begin 3D sensing product shipment towards the end of the year or early 2019 with major ramp in 2019.
“Our business is strong and strategic initiatives remain on track. In fact, our shipments of WLO products are accelerating in 3Q18 and the shipment of 3D sensing products will start towards the end of the year or early 2019. We are very excited about the promising outlook for TDDI, WLO and 3D sensing businesses in the second half of 2018 and leading into 2019. We are more optimistic than ever about the growth opportunities of all three product segments. TDDI, WLO and 3D sensing will significantly contribute to the Company’s top and bottom lines as they represent higher average sales prices (ASPs) and profitability than its traditional display driver IC business,” said Jordan Wu, President and CEO of Himax.
About Himax Technologies, Inc.
Himax Technologies, Inc. (NASDAQ:HIMX) is a fabless semiconductor solution provider dedicated to display imaging processing technologies. Himax is a worldwide market leader in display driver ICs and timing controllers used in TVs, laptops, monitors, mobile phones, tablets, digital cameras, car navigation, virtual reality (VR) devices and many other consumer electronics devices. Additionally, Himax designs and provides controllers for touch sensor displays, in-cell Touch and Display Driver Integration (TDDI) single-chip solutions, LED driver ICs, power management ICs, scaler products for monitors and projectors, tailor-made video processing IC solutions, silicon IPs and LCOS micro-displays for augmented reality (AR) devices and heads-up displays (HUD) for automotive. The Company also offers digital camera solutions, including CMOS image sensors and wafer level optics for AR devices, 3D sensing and machine vision, which are used in a wide variety of applications such as mobile phone, tablet, laptop, TV, PC camera, automobile, security, medical devices and Internet of Things. Founded in 2001 and headquartered in Tainan, Taiwan, Himax currently employs around 2,200 people from three Taiwan-based offices in Tainan, Hsinchu and Taipei and country offices in China, Korea, Japan, Israel and the US. Himax has 2,997 patents granted and 442 patents pending approval worldwide as of June 30, 2018. Himax has retained its position as the leading display imaging processing semiconductor solution provider to consumer electronics brands worldwide.
Forward Looking Statements
Factors that could cause actual events or results to differ materially include, but not limited to, general business and economic conditions and the state of the semiconductor industry; market acceptance and competitiveness of the driver and non-driver products developed by the Company; demand for end-use applications products; reliance on a small group of principal customers; the uncertainty of continued success in technological innovations; our ability to develop and protect our intellectual property; pricing pressures including declines in average selling prices; changes in customer order patterns; changes in estimated full-year effective tax rate; shortages in supply of key components; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; our ability to collect accounts receivable and manage inventory and other risks described from time to time in the Company’s SEC filings, including those risks identified in the section entitled “Risk Factors” in its Form 20-F for the year ended December 31, 2017 filed with the SEC, as may be amended.
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