POWAY, Calif.--(BUSINESS WIRE)--Jul 9, 2018--Cohu, Inc. (NASDAQ: COHU), a leading supplier of semiconductor test and inspection equipment, today announced the introduction of the new Infra-Red Automated Optical Inspection ( AOI) module for enhanced micro-crack and sub-surface defect detection on wafer-level chipscale packages (WLCSPs).

The continuous increase of product quality requirements in IoT, mobility and automotive markets are driving the need for upstream detection of silicon defects on integrated circuits, which are not otherwise identifiable via electrical test. This is a growing segment in semiconductor inspection with increasing volume of WLCSPs and advanced packaging.

Infra-Red imaging has the ability to see through silicon, inspecting the structure underneath the surface that is not otherwise observable with traditional vision inspection systems. Cohu’s new vision module offers a breakthrough by integrating infra-red imaging onto a high-speed automation platform that delivers an economical solution for high quality inspection. This new module, in combination with previously announced Aquilae inspection and 3D Flex metrology, further strengthens Cohu’s differentiation in the growing semiconductor inspection market.

Cohu will demonstrate the Infra-Red AOI module and other innovative products during the SEMICON West show in San Francisco at booth #5650 from July 10 to July 12, 2018.

About Cohu:

Cohu is a leading supplier of semiconductor test and inspection handlers, micro-electro mechanical system (MEMS) test modules, test contactors and thermal sub-systems used by global semiconductor manufacturers and test subcontractors.

Forward-Looking Statements:

Certain matters discussed in this release, including statements concerning Cohu's Infra-Red Automated Optical Inspection capability and WLCSP segment growth are forward-looking statements that are subject to risks and uncertainties that could cause actual results to differ materially from those projected or forecasted. Such risks and uncertainties include, but are not limited to, risks associated with our ability to convert new products into production on a timely basis and to support product development and meet customer delivery and acceptance requirements for new products; our reliance on third-party contract manufacturers and suppliers; failure to obtain customer acceptance resulting in the inability to recognize revenue and accounts receivable collection problems; revenue recognition impacts due to ASC 606; market demand and adoption of our new products; customer orders may be canceled or delayed; the concentration of our revenues from a limited number of customers; intense competition in the semiconductor equipment industry; our reliance on patents and intellectual property; compliance with U.S. export regulations; geopolitical issues; the seasonal, volatile and unpredictable nature of capital expenditures by semiconductor manufacturers; and rapid technological change. These and other risks and uncertainties are discussed more fully in Cohu's filings with the Securities and Exchange Commission, including the most recently filed Form 10-K and Form 10-Q, and in the Registration Statement on Form S-4 that has been filed by Cohu with the SEC containing a prospectus with respect to the Cohu common stock to be issued in the proposed Xcerra transaction and a joint proxy statement of Cohu and Xcerra in connection with the proposed transaction that is contained therein. The forward-looking statements included in this release are not assurances, and speak only as of the date of this release, and Cohu does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

View source version on businesswire.com:https://www.businesswire.com/news/home/20180709005657/en/

CONTACT: Cohu

Jeffrey D. Jones, 858-848-8106

Investor Relations

KEYWORD: UNITED STATES NORTH AMERICA CALIFORNIA

INDUSTRY KEYWORD: TECHNOLOGY HARDWARE OTHER TECHNOLOGY SEMICONDUCTOR

SOURCE: Cohu, Inc.

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PUB: 07/09/2018 04:05 PM/DISC: 07/09/2018 04:06 PM

http://www.businesswire.com/news/home/20180709005657/en